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Products
     ► MPT1000
     ► MPS
     ► MP2100
     ► MP2200
 

Applications
     Semiconductor
     ► Wafer
     ► Backgrind

     ► Data
         Storage

     ► Optics
       
     ► Others

MPT1000

• Non-contact, providing non-destructive thickness measurements
• 0.1 µm thickness resolution, providing thickness uniformity and Q/C control
• TTV, Bow & Warp, Bump Wafer, Tape Wafer

MPS

• Fully automated wafer handling system
• Integrated vibration air isolation system
• Automated Objective changer
• Wafer planar and edge measurements

MP2100

• Non-contact measurement
• Roughness and waviness from a single scan
• Semiconductor
• Optics

MP2200

• Sub-Angstrom height resolution (0.01nm)
• Wafer planar and edge measurements
• Scan lengths from sub micron to 100 mm
• 50 nm Sampling
• Data Storage

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