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Products
     ► MP2100
     ► MP2200
     ► MPS
     ► MPT1000

Applications
     Semiconductor
     ► Wafer
     ► Backgrind

     ► Data
         Storage

     ► Optics
       
     ► Others


MP2100

  • Non-contact measurement
  • Roughness and waviness from a single scan
  • Semiconductor
  • Optics


MP2200

  • Sub-Angstrom height resolution (0.01nm)
  • Wafer planar and edge measurements
  • Scan lengths from sub micron to 100 mm
  • 50 nm Sampling
  • Data Storage


MPS

  • Fully automated wafer handling system
  • Integrated vibration air isolation system
  • Automated Objective changer
  • Wafer planar and edge measurements


MPT1000

  • Non-contact, providing non-destructive thickness measurements
  • 0.1 µm thickness resolution, providing thickness uniformity and Q/C control
  • Wafer Bow and Warp measurements
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