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Product Application Notes:

   MP2100 Backgrind
Backgrind Control
MPT1000 Thickness

Backgrind

Backgrind is a process that thins a wafer from its nominal thickness for smaller packaging requirements, by grinding away wafer material on the backside. The wafers need to have a minimum thickness to prevent breakage without being too thick for packaging.

Problem

1. Roughness control for backgrind is important to insure quality control for follow on process. A wafer that is too smooth or too rough will be considered out of control.

2. Stylus based profilers have several limitations for the measurement of backgrind wafer surfaces. The stylus tip contacts the surface resulting either in particle contamination or damage to the surface. The operation for the instrument dragging a stylus tip over the surface is too slow. Also, the stylus tip radius is often larger than the narrow valleys of a backgrind surface, leading to a smoothing of the overall surface roughness result.

 

Solution

• Non-Contact Profiling system ensures a non-destructive method of taking surface measurements. With Chapman's optical scanning profilers, there is no contact and therefore no damage to the surface.

• Fast measurements without the need to drag a stylus across the surface - fine focused optical beam is used to probe the narrow valleys, giving better representation of the true backgrind surface.

• A wide variety of quick and accurate measurements can be taken for process control.

• Micro-Roughness

• Waviness

• Circumferential Scans - 360° around the wafer at any radius for roughness and waviness.

• Beam auto-focus guarantees correct results even on the thinnest of wafers.

• Die Crack/Edge Chip Inspection by threshold analysis.

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