Products
Support
News/Events
Company
Contact
Home
Products ► MP2100 ► MP2200 ► MPS ► MPT1000 Applications Semiconductor ► Wafer ► Backgrind ► Data Storage ► Optics ► Others
Products ► MP2100 ► MP2200 ► MPS ► MPT1000
Applications Semiconductor ► Wafer ► Backgrind ► Data Storage ► Optics ► Others
Product Application Notes: MP2100 Sub-Angstrom Measurement MPT1000 Thickness Copper Deposition in IC
Other
MEMS
Gallium Arsenide
Ceramics
Plastics
Tool/Die
Non-Contact Profiling system ensures a non-destructive method of taking surface measurements. Chapman Profilers are versatile - they are able to obtain a wide variety of quick and accurate measurements for all types of surfaces. Auto-focus feature in systems guarantees accurate focus over curved parts and therefore correct roughness measurements. Circumferential Scans - 360° around the material at any radius for roughness and waviness. Waviness measurements and mid-spatial wavelengths are easily measured. The long scan length coupled with easy to use software allows for either waviness or roughness measurements in a single scan. Non-contact, providing non-destructive thickness measurements 0.1 μm thickness resolution, providing thickness uniformity and Q/C control
Non-Contact Profiling system ensures a non-destructive method of taking surface measurements.
Chapman Profilers are versatile - they are able to obtain a wide variety of quick and accurate measurements for all types of surfaces.
Auto-focus feature in systems guarantees accurate focus over curved parts and therefore correct roughness measurements.
Circumferential Scans - 360° around the material at any radius for roughness and waviness.
Waviness measurements and mid-spatial wavelengths are easily measured. The long scan length coupled with easy to use software allows for either waviness or roughness measurements in a single scan.
Non-contact, providing non-destructive thickness measurements
0.1 μm thickness resolution, providing thickness uniformity and Q/C control
Return to Top