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Products
     ► MP2100
     ► MP2200
     ► MPS
     ► MPT1000

Applications
     Semiconductor
     ► Wafer
     ► Backgrind

     ► Data
         Storage


     ► Optics
       
     ► Others


Product Application Notes:

MP2100 Sub-Angstrom Measurement
MPT1000 Thickness
Copper Deposition in IC


Other

  • MEMS

  • Gallium Arsenide

  • Ceramics

  • Plastics

  • Tool/Die

  • Other

  • Non-Contact Profiling system ensures a non-destructive method of taking surface measurements.

  • Chapman Profilers are versatile - they are able to obtain a wide variety of quick and accurate measurements for all types of surfaces.

  • Auto-focus feature in systems guarantees accurate focus over curved parts and therefore correct roughness measurements.

  • Circumferential Scans - 360° around the material at any radius for roughness and waviness.

  • Waviness measurements and mid-spatial wavelengths are easily measured. The long scan length coupled with easy to use software allows for either waviness or roughness measurements in a single scan.

  • Non-contact, providing non-destructive thickness measurements

  • 0.1 μm thickness resolution, providing thickness uniformity and Q/C control


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