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Product Application Notes:

MPS
Wafer Edge
Wafer Notch

Wafers

Problem

1. As part of the stringent guidelines in wafer processing, manufacturers need to examine the edge of the wafer as part of their overall quality control.

2. Recent semiconductor trends are decreasing the size of the exclusion zone from 3mm to 1mm. With this decrease in size, monitoring wafer flatness up to the edge is crucial.

Solution

Non-Contact Profiling system ensures a non-destructive method of taking surface measurements.

Chapman Profilers not only measure the front and backside roughness of the wafer, but have also been designed to inspect the edge, bevel, crown, and notch (including the bevel of the notch).

New method of measuring the 3mm exclusion region, as well as into the bevel edge region of wafers.

Wide variety of solutions for process control:

Planar Surface

• Roughness and Waviness from a single scan of the planar surface

• Circumferential Scans at any radius.

• Able to measure the Roll off at the wafer edge (edge zone).

Edge

• Capable of measuring the bevel and apex

• Able to measure the roughness along and across the wafer edge, as well as inside the notch and along the flat.

• Full 360 º Roughness measurement along the edge.

 

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