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Product Application Note: 

MPS
Edge Measurements
Wafer Notch

The MPS is Chapman Instruments’ next generation of non-contact surface and edge profiler with primary focus on matching future requirements of the wafer manufacturing industry. The system was redesigned for more efficient surface measurements and analysis. The MPS utilizes the same non-contact measurement technology as other Chapman profilers. Additionally, the system is integrated with an edge grip robot for 300 mm wafers or an paddle robot for 150mm, 200mm and 300mm wafers.
 
The MPS can be used as both a production tool for in-line quality inspection, as well as a research and development tool for establishing standards and researching tolerances. Users can make either high-resolution linear or circular scans quickly. The powerful, yet user-friendly, Windows XP ® based operational software offers user friendly scan recipes and off-line analysis application. Password security and event viewer/ error logging are standard with Chapman software.

MPS Features:
• Non-contact measurements at any location
• Wafer planar and edge measurements (front/back side, front/back bevel apex)
• 360 degrees circular measurements any surface including edge
• Capability for polished and/or roughed wafers both planar and edge
• Automated Objective Changer
• Integrated Air Cushion
• Unique automated edge measurements
• 3D Topography Scanning
• Edge Grip Robot
• Flipper for Automated Backside Measurements