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     ► MP2100
     ► MP2200
     ► MPS
     ► MPT1000

Applications
     Semiconductor
     ► Wafer
     ► Backgrind

     ► Data
         Storage

     ► Optics
       
     ► Others

 Product Application Note:

   MPT1000 Thickness

The MPT1000 is Chapman Instruments’ latest non-contact system, providing wafer thickness measurements. It can be used as a production tool for in-line quality inspection, a research and development tool for establishing standards, and compiling data for enhancing productivity. The MPT1000 utilizes a sophisticated non-contact measurement technology with a focused laser spot on the wafer surfaces. Users can measure structured taped wafers after backgrind or dicing. The powerful, user-friendly, Windows® based operational software can be programmed to provide automated wafer thickness maps, execute a series of measurements, or report the data off-line for further analysis.

MPS Features:
• Non-contact, providing non-destructive thickness measurements
• 0.1 μm thickness resolution, providing thickness uniformity and Q/C control
• 1 μm laser spot size on both top and bottom wafer surfaces, providing the ability to
  distinguish between small features, e.g. bumped wafers
• Optical Measurement System, providing accurate wafer thickness measurements
  independent of material properties, especially useful for patterned wafers, GaAs and
  other wafer types, after backgrind and dicing
• Wafer Bow and Warp measurements
• Nomarski Viewing System, provides high definition examination of small features on the
  wafer surface
• Measurement through tape on a patterned wafer, provides direct feedback for production
  wafers
• Customized measurement sequences with multiple scans implemented with a single
  keystroke, optional robotic handling
• Optional roughness module