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Chapman Instruments welcomes you…
Please come visit us at our
Semicon West booth and let us show you how to meet your surface roughness and
thickness measurement needs.
We know your metrology requirements are more critical than ever. At Chapman instruments, we are developing
products and techniques that are in the forefront of the industry.
At the exhibit, our experts will provide insightful
information about Chapman products that's crucial for your measurements. Please contact us today to schedule a
meeting.
Our Key Products for Semiconductor Manufactures:
Product:
MP2100
Applications:
Backgrind/Wafer Roughness
Non-Contact
Die Crack
Edge Chip
0.01 nm resolution
Product:
MPT1000 ***New Patent***
Applications:
Wafer Thickness/TTV
Bow/Warp
Backgrind
wafer
Bump Wafer
Tape wafer
0.1 µm resolution
Product:
MPS
Applications:
Roughness/Waviness
Edge
Measurements
Roll-off
High Volume
0.01 nm
resolution
We look forward to seeing you there!
To setup a meeting, email us at sales@chapinst.com
or call us at 585-424-1380.
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